<元器件交易网>元器件讯 12月17日消息，英特尔高管近日表示，英特尔原定于2013年在爱尔兰莱克斯利普工厂开工的14nmFinFET(鳍式场效晶体管，FinField-effecttransistor)制程项目计划并未推迟。
此前大量媒体报道这一计划将至少延迟到2014年，对此，英特尔爱尔兰地区负责人表示，光明在爱尔兰莱克斯利普晶圆分厂14nmFinFET制程项目的运作仍然在议程上，尽管Intel网站上公布，大量在美国培训后被遣送回爱尔兰的工人已经得到安置。
当问到intel 爱尔兰莱克斯利普工厂是否正计划在2013年开工14nmFinFET制程(Intel称之为三维晶体管)时，Intel副总裁兼Intel 爱尔兰地区负责人Eamonn Sinnott说，这个项目在爱尔兰的日程表不会推迟也不会改变。可是Sinnott并没有给出这个日程表的提示。
根据Irish Times此前的报道，在决定推迟P1272 14nm制程的引进至莱克斯利普工厂后，英特尔提前遣送600名在美国接受产品培训后爱尔兰员工回家。
Sinnott 曾表示，这次遣送和和14nm制程引进计划没有关系，英特尔CEO Paul Otellin已明确了14nm制程引进地为Intel爱尔兰区域。（strong交易网 刘Intel摘译）
外媒来源原文：
Ireland still set for FinFETs, says Intel exec
LEIXLIP, Ireland – Intel"s wafer fab campus here is still on course to run a 14-nm FinFET manufacturing process despite the return to Ireland of a large number of workers that had been on assignment at Intel sites in the U.S. for training, according to the general manager of Intel Ireland.
When asked if Intel Ireland was still planning to introduce a 14-nm FinFET manufacturing process – or tri-gate as Intel calls it – at Leixlip in 2013, Eamonn Sinnott, vice president and general manager of Intel Ireland, said there is no delay and no change to the process introduction schedule in Ireland. However, Sinnott declined to give any indication of what schedule, if any, is in place.
The Irish Times recentlyreported that Intel was sending up to 600 Irish staff home early from production training in the U.S. after deciding to delay the introduction of the P1272 14-nm process at Fab 24 in Leixlip. The newspaper reported that the ramp of 14-nm production in Ireland had been pushed out six months to late 2013, attributing the delay to a slowdown in demand rather than technical problems. Intel is also planning to ramp P1272 at Fab D1X in Oregon and at Fab 42 in Arizona.
"The sending home is not related to plans to introduce 14-nm," Sinnott said during a press tour of the Leixlip campus. He added: "Paul Otellini [CEO of Intel] has identified Intel Ireland on the roadmap for the introduction for 14-nm."
At present Fab 24 is manufacturing a variety of logic chip sets on 65-nm CMOS process technology, a mature technology for Intel that could be phased out relatively soon. Intel"s Fab 24 is running the same process as Intel"s Fab 68 in Dalian, China. The introduction of a leading-edge process, such as the P1272 14-nm FinFET process, is clearly fundamental to maintaining Leixlip as an Intel chip manufacturing site. A large sign was noticeable in communal area of Fab 24 that said: "Our chance to shine – 14-nm."
Eamonn Sinnott, general manager of Intel Ireland, discusses the history of the Leixlip wafer fab campus.
However, Intel Ireland is still conducting a $500 million refurbishment to upgrade the former Fab 14 to being capable of production on 300-mm wafers and to link it to Fab 24 with an "air-bridge." The bridge provides for one continuous clean environment extending from Fab 24 to what was Fab 14 allowing wafers to be moved between what were separate cleanrooms.
When the $500 million refurbishment of Fab 14 was announced in January 2011 it was described as a two-year project that would create about 200 long-term technical jobs once completed.
Meanwhile Fab 10, the first wafer fab constructed on the Leixlip campus back in 1991, has been decommissioned and stripped back to a bare shell. Fab 10 is mothballed for now although Intel staff said they are hopeful that the building can be recycled in a similar manner to the way in which the Fab 14 shell is being recycled.
Intel declined to say how many direct employees it has working on chip manufacture at Leixlip, at present.
版权所有