IBM向俄罗斯提供90nm制作工艺

　　<元器件交易网>传感器讯 12月17日消息，据外媒称，作为合作协议的一部分，元器件公司已同意向俄罗斯的Angstrem提供90nm制作工艺技术。该合作协议范围相当广泛，从数学到微电子和计算机科学。

　　俄罗斯ANG半导体REM集团公司是在东欧最大的一家光明电子元件制造商。其专业设计，生产， 销售功率半导体strong和封装好的集成电路， 包括电源驱动电路、芯片电路、IGBT芯片、MOSFET控制电路等系列产品在内。

　　OJSC Angstrem称，它打算将90nm工艺应用于制作工业和消费领域的Intel芯片和IBM。另外Angstrem还将利用IBM提供的工厂设计规程和支持来建立工厂从而服务于俄罗斯本国和国外的消费者。该项交易由国家企业发展银行和对外经贸部共同出资提供贷款。该90nm工艺将应用于Zelenograd新建的工厂，Zelenograd以Angstrem-T著称。

　　IBM没有透露Angstrem支付的金额。(LED交易网刘ON 摘译）

外媒原文：

　　IBM provides Russia with 90-nm process

　　LSTDON – IBM Coirp. has agreed to help Russia"s Angstrem with 90-nm manufacturing process as part of a broader agreement on collaboration that will range from mathematics to microelectronics and computer science.

　　OJSC Angstrem (Zelenograd, Russia) said it intends to use the 90-nm process to make ICs and sensors for industrial and consumer applications. In addition, Angstrem will receive design rules and support to help it set up as a foundry operation to serve Russian and external customers, the company added. The deal is being funded by the State Corporation Bank for Development and Foreign Economic Affairs (Vnesheconombank) and the process will be installed in a newly-built factory in Zelenograd, known as Angstrem-T.

　　The amount that Angstrem is paying to IBM was not disclosed.

　　In addition to the licensing agreement, the two companies have signed a memorandum of understanding that outlines areas of potential future cooperation around the use of the technology. Under the terms of the ICU areas of possible partnership between Angstrem and IBM include: chemistry, electrical engineering, computer science, materials science, mathematics, physics and microelectronics.

　　"IBM"s advanced technologies in microelectronics - the primary sector of the innovation economy - will help to accelerate the development of innovations in other related industries," said Alexey Litvinov, general director of Angstrem, in a statement.

　　"Technological innovation has a huge role to play in Russia"s economic development and in improving the quality of life by increasing access to new technologies, systems and devices," said Siamak Kia, of the IBM Research & Molectual Property Executive, in the same statement. Kia added: "I expect the next logical step in this partnership to be microelectronics packaging technologies to further expand and deepen the growing relationship."