UPC2771TB-E3相关英文资料

    <strong>UPC2771TB-E3 DESCRIPTION

    The µPC2762TB, µPC2763TB and µPC2771TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. Each of the ICs is packaged in super minimold package which is smaller than conventional  minimold. The µPC2762TB, µPC2763TB and µPC2771TB have compatible pin connections and performance to µPC2762T, µPC2763T and µPC2771T of conventional minimold version. So, in the case of reducing your system size, µPC2762TB, µPC2763TB and µPC2771TB are suitable to replace from µPC2762T, µPC2763T and µPC2771T.

    These IC is manufactured using NEC"s 20 GHz fT NESAT?III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and  prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

   UPC2771TB-E3 FEATURES

    · High-density surface mounting : 6-pin super minimold package （2.0 × 1.25 × 0.9 mm）

    · Supply voltage

    : VCC = 2.7 to 3.3 V

    · Medium output power

    : µPC2762TB: PO（1 dB） = +8.0 dBm TYP. @ 0.9 GHz

    µPC2763TB: PO（1 dB） = +9.5 dBm TYP. @ 0.9 GHz

    µPC2771TB: PO（1 dB） = +11.5 dBm TYP. @ 0.9 GHz

    · Power gain

    : µPC2762TB: GP = 13 dB TYP. @ 0.9 GHz

    µPC2763TB: GP = 20 dB TYP. @ 0.9 GHz

    µPC2771TB: GP = 21 dB TYP. @ 0.9 GHz

    APPLICATIONS

    · Buffer amplifiers for mobile telephones : µPC2762TB, µPC2763TB

    · PA driver for PDC800M: µPC2771TB

    ORDERING INFORMATION

    SYSTEM APPLICATION EXAMPLE UPC2771TB-E3